WLCSP without going blind or getting buried
The Teardown 2024 schedule is not yet finalized.
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In this talk Greg Steiert will explain how to design with Wafer Level Chip Scale Packages on a budget. It will start with a high level overview of what features drive up printed circuit board prices, then it will cover some common PCB specifications. From there it will describe how to break out fine pitch BGA packages within these parameters. Finally it will discuss which rules may need to be bent and the potential consequences. These learnings come from real-world open-source designs that have been manufactured in moderate volumes.
Greg Steiert is an embedded systems engineer and perpetual tinkerer. He has designed printed circuit boards professionally but now designs them mostly as a hobby. He presently works in technical marketing at Altera.