by zGlue

A low-power, low-cost, wireless wearable built with chip-stacking technology.

View all updates Jun 25, 2018

A Very Special Endorsement

zGlue’s customizable ZiP technology has won us a lot of endorsements in the industry. One backer we’re especially proud to have is Sonny Vu, Founder and CEO of Misfit Wearables. Sonny was a featured speaker during zOrigin’s official launch at Maker Faire, and is very enthusiastic about how zOrigin will change the future of wearables. He shared his enthusiasm in an exclusive interview, which we’d like to share with you now.

Here’s a preview of what Sonny had to say about zOrigin:

“It really feels like the beginning of this revolution.”

“What compilers did for software… finally we have something like that for hardware.”

“What would Misfit have been like if zGlue was around 6 years ago, when we (Misfit) were around?… We would have been able to crank out products four times or ten times faster.”

You can hear the rest of his thoughts on zOrigin and other industry insights by viewing the full Sonny Vu interview here:


$8,970 raised

of $1 goal

Not Available
Jun 29 2018
funded on

Product Choices



An incredibly small, ready-to-use fitness tracking fob that measures heart rate, temperature, and footsteps. Comes with 3D-printed enclosure, battery, charging cable, quickstart guide, and smartphone app.


zOrigin Dev Board

This dev board breaks out and makes easily accessible all the pins and functionality of the ZGLZ1 chip, the custom ZiP that powers the zOrigin. Includes a PMOD connector, and two electrode pads and cables for heart rate monitoring.


Five-pack of ZGLZ1BA Chips

Prototype your own projects using the same chip as used in zOrigin. Each chip is ten-by-ten, 0.8-mm-pitch BGA package measuring 8.7 mm x 9.1 mm.


zOrigin Deluxe Kit

Includes one of each of the above pledge levels: one zOrigin, one zOrigin Dev Board, and one Five-pack of ZGLZ1BA Chips.



We stack chips on demand by integrating the essential pieces of any connected things - processing, sensing, memory, and communication into one chip - giving unlimited freedom for creating things that are smaller, faster, and cheaper than what standard SoC and PCB integration technologies can offer. We help you build you next big thing, with quality, speed, and scalability.

Meng He

Project Lead

Jawad Nasrullah


Kelly Huang


Myron Shak

Ming Zhang

Hani Abidi

Omar Alnaggar

See Also

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