by zGlue

A low-power, low-cost, wireless wearable built with chip-stacking technology.

View all updates Jun 18, 2018

Join the Chip DIY Revolution -- Create Your Own IC with zCAD

We would like to thank our all of our backers for embracing our new technology with us, and thus we are providing a free trial of zCAD to each and every one of you. The ZGZL1BA IC on zOrigin was designed through zCAD, a cloud-based system design tool that allows users to tackle placement and routing of interconnects, electrical checks, and optimization. Every backer of this campaign will get a free trial of our zCAD software for designing their own chips.

zCAD Feature Highlights:

  • Select from a rich library of chiplets - pre-fabricated ICs that are validated by zGlue to be part of the ZiP system
  • Drag and drop placement tool for chiplets
  • Smart Routing: RF, decoupling capacitors, crystal, ground, power, high resistance and high voltage
  • Programmable interconnects with digital interfaces
  • Design capture: pSpice from OrCAD import and export, zCAD schematic capture

zCAD launch date will be announced later. Please feel free to reach out and share your feedback and ideas!

$8,970 raised

of $1 goal

Not Available
Jun 29 2018
funded on

Product Choices



An incredibly small, ready-to-use fitness tracking fob that measures heart rate, temperature, and footsteps. Comes with 3D-printed enclosure, battery, charging cable, quickstart guide, and smartphone app.


zOrigin Dev Board

This dev board breaks out and makes easily accessible all the pins and functionality of the ZGLZ1 chip, the custom ZiP that powers the zOrigin. Includes a PMOD connector, and two electrode pads and cables for heart rate monitoring.


Five-pack of ZGLZ1BA Chips

Prototype your own projects using the same chip as used in zOrigin. Each chip is ten-by-ten, 0.8-mm-pitch BGA package measuring 8.7 mm x 9.1 mm.


zOrigin Deluxe Kit

Includes one of each of the above pledge levels: one zOrigin, one zOrigin Dev Board, and one Five-pack of ZGLZ1BA Chips.



We stack chips on demand by integrating the essential pieces of any connected things - processing, sensing, memory, and communication into one chip - giving unlimited freedom for creating things that are smaller, faster, and cheaper than what standard SoC and PCB integration technologies can offer. We help you build you next big thing, with quality, speed, and scalability.

Meng He

Project Lead

Jawad Nasrullah


Kelly Huang


Myron Shak

Ming Zhang

Hani Abidi

Omar Alnaggar

See Also

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