We submitted the gerbers for final prototype to our PCB manufacturer. It is currently getting produced. We had to modify the PCB stack-up slightly. Original stack-up was using Rogers RO4003C as substrate for RF layer. Hi-tech didn’t have RO4003C in stock. We changed RO4003C to RO4350B, which is a very similar substrate. Hi-tech will ship the PCBs around Sept 27th. We are expecting to receive them before Sept 30th. We already have all of the chips in enough quantities for a sample run, we will immediately start the assembly once we have the PCBs. We’ve already reserved our spot at the assembly house.