Project update 10 of 11
Since the campaign launched, we have received feedback about the cases from our community. Some of these suggestions were helpful and improved the case performance, so we have considered them in our latest case design update.
For the Tetra case, we added four M3 size mounting holes on the bottom base, so that you can easily mount the case in your product.
For the Mini case, we changed the heat dissipation solution for the LMS7002 chipset by connecting the original RF shield to the case, and connecting the chipset to the RF shield with the thermal pad. Previously, the chipset was directly connected to the case through a custom made RF shield. The reason why we made this change, is that this solution won’t have any negative effect on the RF performance.
The new solution looks like a sandwich:
| top case | thermal pad | RF Shield | thermal pad | LMS7002 |
The new Tetra case was sent to the warehouse in April and the new Mini case will be sent to the warehouse in one week. There are no Minis in stock currently. All orders from now on will receive the new version.