by I-SYST inc.

The finger-tip sized ARM Cortex-M4F module with BT 5, BT Mesh, and 30 I/O

View all updates Oct 12, 2018

Designed for Ease of Use

Most, if not all, tiny modules are designed with compromises. They usually have two options: more I/O and hard to solder, or fewer I/O and easier to solder. The BLYST Nano, on the other hand, is design to be easy to solder without compromising I/O. The video below shows how easily you can hand solder it on the breakout board.

Not only is the BLYST Nano made for easy hand soldering, it’s designed for easy prototyping. The module contains all the required components needed to operate without needing to solder it on a PCB. It’s fully self-contained. And, unlike most modules with under pads, the BLYST Nano PCB is made with high TG (heat resistance) so you can solder wire directly to the pads without lifting it. If you are handy enough, just directly solder the 4 wire VCC, GND, SWDIO, SWDCLK to hookup to a JTAG, the IDAP-Link for instance, and you’re ready to flash the firmware and run.

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Product Choices


BLYST Nano x 2

Two BLYST Nano modules.


BLYST Nano Exploration Kit

Two BLYST Nano modules, one DIP32 Breakout Board (assembled with BLYST Module), one Sensor Board (assembled with BLYST Module), and an IDAP-Link CMSIS-DAP Debug JTAG. This is the perfect starter kit.


BLYST Nano Breakout

One fully assembled DIP32 Breakout Board with BLYST Nano module.


BLYST Nano Sensor

One fully assembled Sensor Board with BLYST Nano module.



This a CMSIS-DAP Debug JTAG board for programming and debugging any ARM Cortex-M series supported the the IDE. Compatible with most IDE such as Keil, CrossWorks, Eclipse (requires OpenOCD), Arduino (require OpenOCD), etc ... It can used for production parallel programming of any Nordic nRF5 series SoC.


I-SYST inc.

Provider of Wireless connectivity, Smart Sensor & IoT Solutions

Nguyen Hoan Hoang

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