"Configurable también para otros protocolos como ANT o propietario, este SoM Bluetooth para la IoT ofrece un dispositivo completamente integrado que no requiere de ningún otro componente en la placa, ahorrando así espacio y costes en los desarrollos."
The arrival of Bluetooth 5 was a significant leap forward for the IoT developer community, especially with its new Bluetooth Mesh functionality, which connects more devices and more sensors. Nearly four billion devices are expected to be shipped with Bluetooth technology in 2018. Bluetooth is driving innovation and creating new markets for wireless audio, wearables, tracking assets, building automation, lighting, sensor farms, etc…
With a design based on the Nordic nRF52832 SoC, combining a low power 64 MHz ARM Cortex-M4F and the 2.4 GHz radio in a single chip, the BLYST Nano SoM (System on Module) is the perfect way to catch this new Bluetooth IoT wave driven by both Bluetooth 5 and Bluetooth Mesh.
There are lots of software developement resources available for the nRF52832. It is well supported by the open source community, from beginning Arduino users to more advanced progammers. The Micropython port is also available for the BLYST Nano based boards.
The nRF52832 incorporates a powerful Cortex-M4F processor enabling the most demanding applications with complex arithmetic requirements to be realized in a single chip solution. The IC supports DSP instructions, a Floating Point Unit (FPU), single-cycle multiply and accumulate, and hardware divide for energy-efficient processing of computationally complex operations.
The 2.4 GHz radio supports multiple protocols including Bluetooth Low Energy, ANT, and 2.4 GHz proprietary. The radio has high definition RSSI (Received Signal Strength Indication) and highly automated functionality, including EasyDMA for direct memory access during packet send and retrieve. Nordic provides protocol stacks for Bluetooth Low Energy. ANT protocol stacks are available directly from ANT.
The nRF52832 SoC is an extremely power efficient device that can run from a supply that provides 1.7 V to 3.6 V. All individual peripherals and clocks can flexibly power down when not required for task operation, thus minimizing power consumption. The IC has a comprehensive system of automated and adaptive power management features. These features range across the entire IC’s operation, from power supply switching to peripheral bus/EasyDMA memory management, to automated shut down of all but the absolute essential peripherals required to perform a task.
NFC™-A tag support is included on-chip. Out-of-Band (OOB) pairing using NFC simplifies the process of authenticated pairing between two Bluetooth devices by exchanging authentication information over an NFC link.
The Sensor Board pledge level
The Sensor Board is a 34 mm diameter round board pre-assembled with a BLYST Nano module. It has a suite of sensors on-board including: temperature, humidity, pressure, air quality, and motion sensing. And it has all the components you’d need to run a stand-alone sensor node with data logging.
The Breakout Board
The Breakout Board is designed to make it easy for you to build prototypes by breaking out all 30 I/O pins and adding some LED indicators and easy pushbuttons.
The IDAP-LinkTM is a low cost CMSIS-DAP JTAG debug probe with enhanced features. It does a lot more than just debugging. The unit appears as a USB disk drive on the host computer. This allows firmware flashing easily by copying the firmware file over without requiring any special flashing software and will work instantly with Windows, Linux & OSX operating systems. It provides a UART to USB bridge for communication between the target device and the PC. It also provides regulated 3.3 V power to directly power the target device over USB without an additional power source.
|Model||BLYST Nano||Taiyo Yuden EYSHCNZWZ||Raytec MDBT42||Murata MBN52832||InsightSIP ISP1507||Rigado BMD-350||Fanstel BC832|
|Dimensions (mm)||10 x 7 x 1.6||12.9 x 9.6 x 2.0||13.8 x 8.8 x 1.9||7.4 x 7 x 1.0||8 x 8 x 1.0||8.7 x 6.4 x 1.5||7.8 x 8.8 x 1.3|
|Antenna||Yes||Yes||Yes||Requires external components||Yes||Yes||Yes|
|Requires extra PCB space for supporting components||No||No||For crystal & DC/DC||For crystal & antenna||18 mm min antenna keep out||For crystal||For crystal & DC/DC|
|Builtin low power DC/DC||Yes||Yes||No||No||Yes||Yes||No|
|Builtin low power crystal||Yes||Yes||No||No||Yes||No||No|
|Hand-assembly prototyping||Easy pads - edge only||Difficult bottom pads||Intermediate bottom pads||Difficult bottom pads||Very difficult LGA pads||Difficult bottom pads||Very difficult LGA pads|
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