The Run 1 wafers are diced and the individual dies can now be sorted. Here is a look at the process.

A diced wafer - note the score marks visible on the lower half

The die sorting robot picking up individual dies from the diced wafer

How Die Sorting Works

After the wafers are cut into individual dies, each die needs to be picked up, inspected, and placed into a tape-and-reel for shipping. This is handled by the sorting robot which works through the diced wafer one die at a time.

Note the white layer of material under the wafer - this is tape. It holds the wafer together and the dies in place, since the wafer loses all rigidity after the dicing.

Eventually your die will end up in one of these reels.

Shipping Timeline

We have started shipping bare dies and chip-on-board packaged dies. Some of you may have received shipping notifications, but be sure to keep an eye out.

Run 2 Reminder

Run 2 is open until 30 June 2026.

• Run 2 on Crowd Supply
• Discord

-Tim ‘mithro’ Ansell