Last Chance to Buy a Slot
This is the final opportunity to get on to Run 2, after that you'll be waiting for Run 3. Read the full update.
Run 2 Deadline Update and Reminder
Due to delays in getting the submission platform up and running, the deadline for having a clean GDS submitted for Run 2 has been extended by 2 weeks. Note: the **purchase** deadline has not changed. You have less than a week to purchase a slot, if you haven't already. Read the full update.
Taping Out KianV - a Linux/XV6-capable RISC-V SoC
In this update we'll be exploring a homegrown SoC which is capable of booting Linux, µLinux and XV6. It implements the RISC-V RV32IMA ISA alongside additional extensions for more functionality. Read the full update.
Chip-on-Board Packaging Progress
Run 1 bare dies and chips-on-board (COBs) have shipped - join us to have a look into the process. Read the full update.
Die Sorting with Robots
The Run 1 wafers are diced and the individual dies can now be sorted. Here is a look at the process. Read the full update.
wafer.space @ Hackaday Europe 2026
The wafer.space and Tiny Tapeout teams will be attending Hackaday Europe 2026 in Lecco, Italy. Read the full update.
Early Bird Pricing Ends Soon
Just a quick reminder that to get early bird pricing on wafer.space GF180MCU Run #2, you need to get your payment in by 30 April 2026 @ 11:59 PM AoE. Read the full update.